PCB Agbara

Igbimọ Circuit ti a tẹjade jẹ okuta igun-ile ti awọn ọja itanna, o ṣe pataki pupọ fun awọn ọja rẹ le ṣiṣẹ ni iduroṣinṣin fun igba pipẹ tabi rara.Bi awọn kan ọjọgbọn PCB ati PCB Apejọ olupese, PCBFuture fi kan ga iye lori awọn didara ti Circuit lọọgan.

PCBFuture bẹrẹ lati iṣowo iṣelọpọ PCB, lẹhinna fa si apejọ PCB ati awọn iṣẹ wiwa awọn paati, ni bayi ti di ọkan ninu olupese apejọ PCB turnkey ti o dara julọ.A ṣe ọpọlọpọ awọn igbiyanju lati ṣe idoko-owo lori awọn ohun elo ilọsiwaju fun imọ-ẹrọ to dara julọ, eto inu iṣapeye fun ṣiṣe to dara julọ, fi agbara fun awọn oṣiṣẹ fun awọn ọgbọn to dara julọ.

Ilana Nkan Agbara ilana
Alaye mimọ Agbara iṣelọpọ Iwọn Layer 1-30 fẹlẹfẹlẹ
Teriba ati lilọ 0,75% boṣewa, 0,5% to ti ni ilọsiwaju
Min.ti pari PCB iwọn 10 x 10mm(0.4 x 0.4")
O pọju.ti pari iwọn PCB 530 x 1000mm(20.9 x 47.24 ")
Olona-tẹ fun afọju / sin vias Olona-tẹ Cycle≤3 igba
Pari ọkọ sisanra 0.3 ~ 7.0mm(8 ~ 276mil)
Pari ọkọ sisanra ifarada +/- 10% boṣewa, +/- 0.1mm to ti ni ilọsiwaju
Ipari dada HASL, asiwaju ọfẹ HASL, goolu filasi, ENIG, Pipa goolu lile, OSP, Tin Immersion, fadaka immersion, bbl
Ipari dada ti o yan ENIG+Gold ika, Filaṣi goolu+Gold ika
Ohun elo Iru FR4, Aluminiomu, CEM, Rogers, PTFE, Nelco, Polyimide / Polyester, bbl Tun le ra awọn ohun elo bi ìbéèrè
Ejò bankanje 1/3oz ~ 10oz
Prepreg Iru FR4 Prepreg, LD-1080(HDI) 106, 1080, 2116, 7628, ati be be lo.
Igbeyewo Gbẹkẹle Peeli agbara 7.8N/cm
Fammability 94V-0
Ionic koti ≤1ug/cm²
Min.dielectric sisanra 0.075mm(3mili)
Ifarada impedance +/- 10%, min le ṣakoso +/- 7%
Layer inu&Layer Gbigbe Aworan Agbara ẹrọ Scrubbing Machine Sisanra ohun elo: 0.11 ~ 3.2mm(4.33mil ~ 126mil)
Iwọn ohun elo: min.228 x 228mm(9 x 9")
Laminator, Exposer Sisanra ohun elo: 0.11 ~ 6.0mm(4.33 ~ 236mil)
Iwọn ohun elo: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ")
Etching Line Sisanra ohun elo: 0.11 ~ 6.0mm(4.33mil ~ 236mil)
Iwọn ohun elo: min.177 x 177mm(7 x 7")
Ti abẹnu Layer Ilana Agbara Min.akojọpọ ila iwọn / aye 0.075/0.075mm(3/3mil)
Min.aaye lati iho eti to conductive 0.2mm(8mil)
Min.akojọpọ Layer annular oruka 0.1mm(4mil)
Min.akojọpọ Layer ipinya kiliaransi 0.25mm (10mil) boṣewa, 0.2mm (8mil) to ti ni ilọsiwaju
Min.aye lati eti ọkọ si conductive 0.2mm(8mil)
Min.aafo iwọn laarin Ejò ilẹ 0.127mm(5mili)
Aidogba Ejò sisanra fun akojọpọ mojuto H/1oz, 1/2oz
O pọju.ti pari Ejò sisanra 10oz
Lode Layer Ilana Agbara Min.lode ila iwọn / aaye 0.075/0.075mm(3/3mil)
Min.iho pad iwọn 0.3mm(12mil)
Agbara ilana O pọju.iho tenting iwọn 5 x 3mm(196.8 x 118mil)
O pọju.iho tenting iwọn 4.5mm(177.2mil)
Min.tenting ilẹ iwọn 0.2mm(8mil)
Min.oruka annular 0.1mm(4mil)
Min.BGA ipolowo 0.5mm(20mil)
AOI Agbara ẹrọ Orbotech SK-75 AOI Sisanra ohun elo: 0.05 ~ 6.0mm(2 ~ 236.2mil)
Iwọn ohun elo: max.597 ~ 597mm(23.5 x 23.5")
Orbotech Ves ẹrọ Sisanra ohun elo: 0.05 ~ 6.0mm(2 ~ 236.2mil)
Iwọn ohun elo: max.597 ~ 597mm(23.5 x 23.5")
Liluho Agbara ẹrọ MT-CNC2600 Iho ẹrọ Sisanra ohun elo: 0.11 ~ 6.0mm(4.33 ~ 236mil)
Iwọn ohun elo: max.470 ~ 660mm(18.5 x 26")
Min.iwọn lilu: 0.2mm (8mil)
Agbara ilana Min.olona-lu lu bit iwọn 0.55mm(21.6mil)
O pọju.ipin abala (iwọn igbimọ ti o ti pari iwọn VS Drill) 12:01
Ifarada ipo iho (akawe pẹlu CAD) +/- 3 milionu
Counterbore iho PTH&NPTH, Igun oke 130°, Iwọn ila opin oke <6.3mm
Min.aaye lati iho eti to conductive 0.2mm(8mil)
O pọju.lu bit iwọn 6.5mm(256mil)
Min.olona-lu Iho iwọn 0.45mm(17.7mil)
Ifarada iwọn Iho fun titẹ fit +/- 0.05mm(+/- 2mil)
Min.Ifarada iwọn Iho PTH +/- 0.15mm(+/- 6mil)
Min.NPTH Iho iwọn ifarada +/-2mm(+/-78.7mil)
Min.aye lati eti iho si conductive (vias afọju) 0.23mm(9mil)
Min.lesa lu iwọn 0.1mm(+/- 4mil)
Countersink iho igun & Diamita Oke 82,90,120°
Ilana tutu Agbara ẹrọ Panel&Apẹẹrẹ laini fifi sori ẹrọ Sisanra ohun elo: 0.2 ~ 7.0mm(8 ~ 276mil)
Iwọn ohun elo: max.610 x 762mm(24 x 30")
Deburring Maching Sisanra ohun elo: 0.2 ~ 7.0mm(8 ~ 276mil)
Iwọn ohun elo: min.203 x 203mm(8" x 8")
Laini Desmear Sisanra ohun elo: 0.2mm ~ 7.0mm(8 ~276mil)
Iwọn ohun elo: max.610 x 762mm(24 x 30")
Tin plating ila Sisanra ohun elo: 0.2 ~ 3.2mm(8 ~ 126mil)
Iwọn ohun elo: max.610 x 762mm(24 x 30")
Agbara ilana Iho odi Ejò sisanra apapọ 25um (1mil) boṣewa
Pari Ejò sisanra ≥18um(0.7mil)
Min ila iwọn fun etching siṣamisi 0.2mm(8mil))
Max.pari Ejò àdánù fun akojọpọ & lode fẹlẹfẹlẹ 7oz
O yatọ si Ejò sisanra H/1oz,1/2oz
Solder Boju & Silkscreen Agbara ẹrọ Scrubbing Machine Sisanra ohun elo: 0.5 ~ 7.0mm(20 ~ 276mil)
Iwọn ohun elo: min.228 x 228mm(9 x 9")
Afihan Sisanra ohun elo: 0.11 ~ 7.0mm(4.3 ~ 276mil)
Iwọn ohun elo: max.635 x 813mm(25 x 32")
Ṣe idagbasoke ẹrọ Sisanra ohun elo: 0.11 ~ 7.0mm(4.3 ~ 276mil)
Iwọn ohun elo: min.101 x 127mm(4 x 5")
Àwọ̀ Solder boju awọ Alawọ ewe, alawọ ewe matte, ofeefee, dudu, bulu, pupa, funfun
Silkscreen awọ Funfun, ofeefee, dudu, bulu
Solder boju Agbara Min.solder boju šiši 0.05mm(2mil)
O pọju.edidi nipasẹ iwọn 0.65mm(25.6mil)
Min.iwọn fun laini agbegbe nipasẹ S/M 0.05mm(2mil)
Min.solder boju Lejendi iwọn 0.2mm (8mil) boṣewa, 0.17mm (7mil) to ti ni ilọsiwaju
Min.solder boju sisanra 10um(0.4mil)
Solder boju sisanra fun nipasẹ tenting 10um(0.4mil)
Min.erogba epo ila iwọn / aaye 0.25/0.35mm(10/14mil)
Min.olutọpa erogba 0.06mm(2.5mil)
Min.erogba epo ila kakiri 0.3mm(12mil))
Min.aye lati erogba Àpẹẹrẹ to paadi 0.25mm(10mil)
Min.iwọn fun peelable boju ideri ila / paadi 0.15mm(6mil)
Min.solder boju Afara iwọn 0.1mm(4mil))
Solder boju Lile 6H
Agbara Boju Peelable Min.aye lati peelable boju Àpẹẹrẹ to paadi 0.3mm(12mil))
O pọju.iwọn fun iho agọ iboju iboju peelable (Nipa titẹ iboju) 2mm(7.8mil)
O pọju.iwọn fun iho agọ iboju iboju peelable (Nipa titẹ sita aluminiomu) 4.5mm
sisanra boju-boju peelable 0.2 ~ 0.5mm(8 ~ 20mil)
Agbara Silkscreen Min.silkscreen ila iwọn 0.11mm(4.5mil)
Min.silkscreen iga ila 0.58mm(23mil)
Min.aaye lati Àlàyé to paadi 0.17mm(milionu meje)
Dada Ipari Dada Ipari Agbara O pọju.goolu ika ipari 50mm(2")
ENIG 3 ~ 5um (0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) goolu
ika goolu 3 ~ 5um (0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) goolu
HASL 0.4um (0.016mil) Sn/Pb
HASL ẹrọ Sisanra ohun elo: 0.6 ~ 4.0mm(23.6 ~ 157mil)
Iwọn ohun elo: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25")
Lile goolu plating 1-5u"
Immersion Tin 0.8 ~ 1.5um (0.03 ~ 0.059mil) Tin
Fadaka immersion 0.1 ~ 0.3um (0.004 ~ 0.012mil) Ag
OSP 0.2 ~ 0.5um (0.008 ~ 0.02mil)
E-idanwo Agbara ẹrọ Flying ibere igbeyewo Sisanra ohun elo: 0.4 ~ 6.0mm(15.7 ~ 236mil)
Iwọn ohun elo: max.498 x 597mm(19.6 ~ 23.5")
Min.aaye lati paadi idanwo si eti igbimọ 0.5mm(20mil)
Min.conductive resistance
O pọju.idabobo resistance 250mΩ
O pọju.foliteji igbeyewo 500V
Min.igbeyewo paadi iwọn 0.15mm(6mil))
Min.igbeyewo paadi to paadi aye 0.25mm(10mil)
O pọju.idanwo lọwọlọwọ 200mA
Profaili Agbara ẹrọ Iru profaili NC afisona, V-ge, Iho awọn taabu, ontẹ iho
NC afisona ẹrọ Sisanra ohun elo: 0.05 ~ 7.0mm(2 ~ 276mil)
Iwọn ohun elo: max.546 x 648mm(21.5 x 25.5")
V-ge ẹrọ Sisanra ohun elo: 0.6 ~ 3.0mm(23.6 ~ 118mil)
Iwọn ohun elo ti o pọju fun gige-V: 457mm(18)
Agbara ilana Min.afisona bit iwọn 0.6mm(23.6mil)
Min.ifarada ìla +/- 0.1mm(+/- 4mil)
V-ge igun iru 20°, 30°, 45°, 60°
V-ge ifarada igun +/-5°
V-ge ìforúkọsílẹ ifarada +/- 0.1mm(+/- 4mil)
Min.aaye ika goolu +/- 0.15mm(+/- 6mil)
Ifarada igun Bevelling +/-5°
Bevelling wa ni sisanra ifarada +/- 0.127mm(+/- 5mil)
Min.inu rediosi 0.4mm(15.7mil)
Min.aye lati conductive to ìla 0.2mm(8mil)
Ifarada ijinle Countersink/Counterbore +/- 0.1mm(+/- 4mil)